Our Dual-Frequency Processing
Technology:
We combine multiple technologies into a single
Ultrasonic Reaction Chamber to dramatically increase reaction rates. This
arrangement ensures complete and thorough treatment for all of the material
positioned inside this cavity.
The features integrated into Dual-Frequency Systems include:
Transducer Positioning:
The two sound sources must be directly opposing
one another. The longitudinal pressure waves created by each sound source must
interact symmetrically for maximum benefit.
The wave symmetry is critical to ensure that the wave fronts create a completely uniform energy profile across the reactor's gap.
A staggered or offset positioning of the transducers minimizes the effective size of the dual-frequency reaction zone.
The ultrasonic processing results will be obtainable with a non-opposing arrangement. However, the true potential of our Dual-Frequency Processing Technology will not be available or possible.
Pressure Wave Amplification:
The dynamic relationship between the (2) chosen
fundamental frequencies creates a constructive sound wave pressure amplitude
amplification effect. The abnormally high relative pressure amplitude of a
Dual-Frequency Reactor exceeds all single frequency processing capabilities.
The Cavitation Intensity Amplification Effect created by
a Dual-Frequency Reactor driven at 16 kHz and 20 kHz.
The sound energy emitted from two opposing sources has a unique cavitation intensity amplification effect. The pressure waves superimpose upon one another, rendering constructive reinforcement and destructive interference.
The magnitude of the relative pressure amplitude is doubled when the two waves complement and fortify one-another (aka constructive reinforcement). Destructive interference is when the waves cancel each other. The large relative pressure differential between the high and low pressure zones maximizes the intense implosive forces within the processing chamber for the exposure time allotted. This abnormally high relative pressure amplitude exceeds single frequency processing capabilities.
Beat-Frequency and Multiple Harmonics:
The two fundamental frequencies produces a third frequency
called the beat frequency. The beat frequency is a highly energized localized
zone that is in constant motion across the processing chamber's gap.
The Sub-Harmonic Frequency Spectrum created by a Dual-Frequency Reactor driven at 16 kHz and 20 kHz.
Driving the opposing diaphragm plates at different resonant frequencies creates a Beat-Frequency with Multiple Harmonics. The Beat-Frequency and Multiple Harmonics eliminates acoustic dead spots within the reactor's processing cavity.
The rippling effect of the beat-frequency moves the fortified shock wave back-and-forth throughout the Reaction Cell's gap. The entire ultrasonic chamber is uniformly activated to produce consistent processing results for all particles passing through.
back to DFR Reactor Operational Details
July 27, 2006
